I remember an ad Intel made about how AMD was “gluing their chips together”, being the chiplet design. In the end ram speeds continued to improve and thus the bottlenecks were alleviated, and now every design is the same.
@teppa Interface between chiplets still introduces latency. Perhaps photonics will eventually overcome this but it is currently an issue with chiplet designs.
I remember an ad Intel made about how AMD was “gluing their chips together”, being the chiplet design. In the end ram speeds continued to improve and thus the bottlenecks were alleviated, and now every design is the same.
@teppa Interface between chiplets still introduces latency. Perhaps photonics will eventually overcome this but it is currently an issue with chiplet designs.